New technique for flexible circuits to boost smart packaging

There are 2 main approaches to building circuits: the rigid one (silicon circuits) and the new flexible one. Chips are used to reach the performance needed for sophisticated specialized functions. However, for higher complexity systems the chips must be bonded together.
Researchers at the University of Barcelona (ES) have demonstrated a new bonding technique, SMD or surface mounted devices, that uses an inkjet printer with ink that incorporates silver nanoparticles. The researchers believe that their work will i.e. improve existing RF tags and boost smart packaging. An article about the research is published in the Journal of Applied Physics (News Item ScienceDaily, 14 March 2017).
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Click here for the published article (2.86 MB).

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