Top 5 manufacturers of blister packaging 2016-2020

21 October 2016

In a new report Technavio has announced the top 5 leading vendors for the global blister packaging market. The top 5 vendors identified are Amcor, Bemis, Owens-Illinois, Sonoco and WestRock.
Players in this market compete on the basis of performance, innovation, product features, quality, cost, and financial stability. The competition is very intense due to the presence of various established players in the market. Vendors are investing in the development of innovative product lines to increase their sales and profitability in the market. The vendors are introducing smart blister packaging that enables companies to track their packages (Press Release Technavio, 7 October 2016).
Click here for the press release.
Click here for more information about the report.

If you have any questions about this subject, please contact us: info@nvc.nl, +31-(0)182-512411. This item is also included in our monthly overview, the NVC Members-only Update.