Electrospun nanocomposite films with high barrier properties

26 November 2014

High barrier properties of packaging films provide longer shelf life for food products. Researchers at the Indian Institute of Technology Madras used an application of electrospinning technique to prepare nanoclay composite fibres coated packaging (test) films with high barrier properties against oxygen and moisture. Potato chips and bread were then packaged in the films and compared with polypropylene films.
The researchers found less oxygen permeability in the chips packaged in the test films. The shelf life of bread packed in test films increased by 2 days due to inhibition of microbial growth. An article about the research is published in Innovative Food Science & Emerging Technologies.
Click here for an abstract of the article.

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